Description
BGA reballing balls – Sn/Pb alloy
Leaded solder balls for BGA reballing, availble in 9 different diameters.
Alloy composition: Sn63/Pb37.
Packaging: 250.000 pieces Jar.
Available diameters: 0,25mm – 0,30mm – 0,35mm – 0,40mm – 0,45mm – 0,50mm – 0,55mm – 0,60mm – 0,76mm.