Description
BGA reballing balls – Sn/Ag/Cu alloy
Lead-free solder balls for BGA reballing, available in 9 different diameters.
Alloy composition: Sn96.5/Ag3/Cu0.5.
Packaging: 250.000 pieces jar.
Available sizes (Diameter): 0,25mm – 0,30mm – 0,35mm – 0,40mm – 0,45mm – 0,50mm – 0,55mm – 0,60mm – 0,76mm.