PLS2000 Soldering Mask (2 Sizes)

Price excluding taxesPrice including taxes
7,45/Pc   –   123,46/Pc9,09/Pc   –   150,62/Pc
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Product Code: PLS2000
Categories: ,

Description

PLS 2000 peelable solder mask

PLS 2000Soldering mask, available in 2 sizes.
Premium quality, natural latex based product. Characterized by very low smell, thanks to the low content of ammonia in its formula.
Designed for the protection of PCBs during wave soldering (protection of holes, screw, pads, etc. from fluxes and soldering alloys) and coating (protection of a certain PCB area from conformal coating products) processes. Suitable also for the temporary fixing of components (e.g. PTH connectors) during wave soldering.
The high stability of PLS 2000 permits to obtain a very good coverage of surfaces. For this reason, the consumption is very low compared to other products.

Selectable sizes: Squeeze bottle with dispensing nozzle (215g, >220ml), Jerrycan for refill (5kg, >5200 ml).

Specifications

  • Low viscosity
  • High insulation resistance (> 200 MOhm/cm)
  • Non-corrosive product, compatible with all PCB finishes
  • Compatible with both lead free and leaded soldering processes
  • Fast curing times
  • Perfect visibility of the cured product
  • Good exposure times on the PCB both before and after soldering/coating processes
  • Removal is easy and does not leave residues
  • V.O.C. free
  • REACH compliant.

Methods of employ:

  • Ready to use product
  • Application: Directly (from the squeeze bottle with nozzle), By syringe (with an automatic dispenser or manually), Stencil
  • Apply the thinnest possible layer of product on the PCB. Ideal thickness: up to 0.5 mm (is recommended not to exceed 1 mm)
  • CURING TIMES
    Curing times depend on the thickness of the applied layer and the working tempertaure
    To obtain a fast curing, is important to apply the lowest possible thickness of product on the PCB
    Given an ideal thickness up to 0.5 mm, curing times are as follow:
    – Room temperature up to 25 °C: from 30 to 120 minutes
    – Oven drying up to 80 °C: from 10 to 20 minutes
  • EXPOSURE TIMES
    – Max. exposure times BEFORE proceeding to soldering/coating: up to 7 days **
    – Max. exposure times AFTER soldering/coating: Remove within 7 days **
  • REMOVAL
    After processing, PLS 2000 residues are perfectly visible
    Removal is easy, manually or by meand of tweezers, and does not leave any residue
    Cleaning after removal is not necessary
    Is recommended to remove residues before any defluxing process
  • HANDLING
    During the application of PLS 2000, handling precautions are not required
    In case of contact with hands, is possible to wash them with cold water and soap.

** In any case, is recommended to process the PCB as quickly as possible.

PRODUCT IDENTIFIER IN THE SAFETY DATA SHEET (Trade name): PLS 2000
LABEL ELEMENTS: Classification according to EC Regulation 1272/2008 (CLP) and subsequent amendments and supplements:
The product is not classified.
DETAILS OF THE SUPPLIER OF THE SAFETY DATA SHEET: Available on request.

Additional information

Package size

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