Description

Bungard Protec 2030/2040

PROTEC SN – Professional equipment for the production of final surfaces on printed circuit boards.
The machine includes all the necessary tanks and electrical equipment in a very compact design.

Available models:

• PROTEC 2030
  Max. board size: 200 x 300 mm
  Teflon heating elements: 2 pieces x 400W
  Tank volume: 10L
  Dimensions (LxWxH): ca. 790 x 710 x 1160 mm
  Power supply: Single-phase 230V, AC.
• PROTEC 3040
  Max. board size: 300 x 400 mm
  Teflon heating elements: 2 pieces x 800W
  Tank volume: 20L
  Dimensions (LxWxH): ca. 790 x 810 x 1160 mm
  Power supply: Single-phase 230V, AC.

Features

• TANK 1 | Microetch – With ball cock outlet valve, cover, timer
• TANK 2 | Spray / Rinsing – Regulated by an angle seat solenoid valve, with ball cock outlet valve
• TANK 3 | Organic metal – With ball cock outlet valve, cover, timer
• TANK 4 | Chemical tin 7001 – With PTFE heating element thermostatically regulated 20-80°C, ball cock outlet valve, cover, timer
• TANK 5 | Warm rinsing – With stainless steel heating element thermostatically regulated 20-50°C, ball cock outlet valve, cover, timer
• Underframe (plastic), control unit with main switch
• PCB holder.

Advantages

Tin layers which have been created with the Protec ORMECON® process guarantee:

• Planar surface for SMD technology
• Pure tin deposit, even with high copper load of the bath
• Significant reduction of diffusion velocity
• Possibility of multiple soldering, even with intermediate storage
• Improved temperature resistance.

The design of PROTEC SN allows easy modifications. By adding or skipping tanks you can adapt the PROTEC to the requirements of the following processes:

• Electroless Nickel / Electroless Gold
• OSP (Organic Solderability Preservative).